Decentralized Bonds Platform D/Bond Rebrands Following Successful Funding Rounds

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Press Release: Decentralized bonds project Debond Protocol rebrands to D/Bond following successful seed funding round as the company plans international expansion. 

21 April 2022, Paris, France —  D/Bond is an innovative start-up that is bringing decentralized bonds to the blockchain using their pioneering ERC/3475 token standard. The decentralized bonds platform has just announced a major rebranding following its successful seed and series A funding round in which several industry leaders invested. 

Formerly known as Debond Protocol, the new-look company has changed not only its name, but also website design and logo as a part of the platform’s international growth strategy. Alongside the unveiling of its newly-designed website, D/Bond's rebranding will broaden its appeal to investors in new markets. 

The recent expansion is in part due to a successful seed and series A funding round in which several prominent investors participated, elevating the value of D/Bond to an estimated $12.5 million USD. Bixin Ventures, Spark Digital Capital, Collinstar Capital, Exnetwork Capital, HOT DAO (Hotlabs), Waterdrip Capital, Lotus Capital, Crypto Dorm Fund, and Wave Capital all participated. 

D/Bond CEO Yu Liu stated that:

“D/Bond is creating a system to securitize any digital asset. We believe D/Bond has the potential to be an important player in the decentralization of this market, hence the rebrand. We seek to partner with many more investors who believe in our multi-layered pool approach to reduce slippage and transaction fees. We are confident that, thanks to our offer, ERC/3475 D/Bonds that are also tradable on our secondary market, we are going to